Humidity Effects on Sn Whisker Formation-Reference-Cited by-同舟云学术

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Humidity Effects on Sn Whisker Formation

Published:2006-10 Issue:4 Volume:29 Page:239-245
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Oberndorff Pascal,Dittes Marc,Crema Paolo,Su Peng,Yu Elton

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/4052443/04052454.pdf?arnumber=4052454

Cited by 39 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Analytical Model of Spontaneous Whisker Growth on Strain Accumulation From Contiguous Film Network;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09

2. Tin Whiskers Growth in Electronic Assemblies;Recent Progress in Lead-Free Solder Technology;2022

3. Corrosion-induced tin whisker growth in electronic devices: a review;Soldering & Surface Mount Technology;2017-02-06

4. Methods for fast, reliable growth of Sn whiskers;Surface Science;2016-10

5. The surface energies of β-Sn — A new concept for corrosion and whisker mitigation;Microelectronics Reliability;2015-12

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