Surface preparation and phenomenological aspects of direct bonding-Reference-Cited by-同舟云学术

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Surface preparation and phenomenological aspects of direct bonding

Published:1995-01 Issue:1-2 Volume:49 Page:23-46
ISSN:0165-5817
Container-title:Philips Journal of Research
language:en
Short-container-title:Philips Journal of Research

Author:

Haisma Jan,Spierings Gijsbertus A.C.M.,Michielsen Theo M.,Adema Cor L.

Publisher

Elsevier BV

Subject

General Engineering

Reference18 articles.

1. Silicon wafer fabrication and (potential) applications of direct-bonded silicon;Haisma;Philips J. Res.,1995

2. Adhesive avalanche in covalently bonded materials;Nelson;Phys. Rev. B,1992

3. Fracture and contact adhesion energies of mica—mica, silica—silica and mica—silica interfaces in dry and moist atmospheres;Wan;J. Am. Ceram. Soc.,1992

4. Diversity and interfacial phenomena in direct bonding;Spierings,1992

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 1.55-μm-Range Vertical-Cavity Surface-Emitting Lasers, Manufactured by Wafer Fusion of Heterostructures Grown by Solid-Source Molecular-Beam Epitaxy;Semiconductors;2020-10

2. The fabrication technology of VCSELs emitting in the 1.55 μm waveband;Journal of Physics: Conference Series;2020-10-01

3. Study of the perpendicular self-assembly of a novel high-χ block copolymer without any neutral layer on a silicon substrate;RSC Advances;2019

4. A Review of Hydrophilic Silicon Wafer Bonding;ECS Journal of Solid State Science and Technology;2014

5. Low-Temperature DirectWafer Bonding;Lattice Engineering;2012-11-27

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