Subject
Materials Chemistry,Condensed Matter Physics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Cited by
7 articles.
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1. Package Reliability;Microelectronics Packaging Handbook;1997
2. Temperature dependence of microelectronic device failures;Quality and Reliability Engineering International;1990-09
3. Ceramic Packaging;Microelectronics Packaging Handbook;1989
4. Package Reliability;Microelectronics Packaging Handbook;1989
5. Application of Borate Glasses in Electronics;Borate Glasses;1978