Temperature dependence of microelectronic device failures

Author:

Pecht Michael,Lall Pradeep,Whelan Stanley J.

Publisher

Wiley

Subject

Management Science and Operations Research,Safety, Risk, Reliability and Quality

Reference55 articles.

1. Correspondence with Dave Taylor of Power Products Division, 29 September 1989.

2. Summary Chart of 1984/1987 Failure Analysis Memos, Westinghouse Electric Corp., 1989.

3. and , ‘Analysis of aeronautical equipment environmental failures’, May 1971. AFFDL-TR-71-32.

4. Internal lead fatigue through thermal expansion in semiconductor devices

5. and , ‘A failure prediction model for wire bonds’, Proc. of the 1989 Intl. Symp. on Hyb. Micro., 1989, pp. 607–613.

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