Effect of cooling fluids on high frequency electric and magnetic fields in microelectronic systems with integrated TSVs
Author:
Funder
DARPA
GaTech
DOE/NETL
Florida International University
Publisher
Elsevier BV
Subject
General Engineering
Reference26 articles.
1. Gen-3 thermal management technology: role of microchannels and nanostructures in an embedded cooling paradigm;Bar-Cohen;J. Nanotechnol. Eng. Med.,2013
2. V. Sahu, Y.K. Joshi, A.G. Fedorov, Experimental investigation of hotspot removal using superlattice cooler, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), in: Proceedings of the 12th IEEE Intersociety Conference, Las Vegas, Nevada, 2010.
3. 3-D hyperintegration and packaging technologies for micro–nano systems;Lu;Proc. IEEE,2009
4. A. Dembla, Y. Zhang, M.S. Bakir, Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs, in: Proceedings of the Interconnect Technology Conference (IITC), IEEE International, 2012, pp. 1–3. 〈http://doi.org/10.1109/IITC.2012.6251587〉.
5. Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot;Abdoli;Int. J. Therm. Sci.,2015
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit;Journal of Electronic Packaging;2023-06-06
2. Investigation of an Embedded Cooling RF Silicon Interposer for an Ultrahigh Heat Flux GaN TR Array;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02
3. Simulation of mixed convection of a variable viscosity fluid in a partially porous horizontal channel with a heat-generating source;Computer Research and Modeling;2019-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3