In-situ characterization up to 100 GHz of insulators used in new 3D “System in Package on board” (SiPoB) technologies-Reference-Cited by-同舟云学术

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In-situ characterization up to 100 GHz of insulators used in new 3D “System in Package on board” (SiPoB) technologies

Published:2021-02 Issue: Volume:108 Page:104990
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Houzet Gregory^ORCID,Lacrevaz Thierry,Bermond Cedric^ORCID,Artillan Philippe^ORCID,Auchère David,Schwarz Laurent,Flechet Bernard

Funder

Direction Générale de la Compétitivité, de l’Industrie et des Services

Publisher

Elsevier BV

Subject

General Engineering

Reference19 articles.

1. A review of 3D packaging technology;Al Sarawi;IEEE Trans. Compon. Packag. Manuf. Technol. Part B: Advanced Packaging,1998

2. System design issues for 3D system-in-package (SiP);Miettinen,2004

3. New encapsulation process for the SiP (system in package);Kim,2007

4. Study of 3D SiP (System-in-Package) module for package-on-package application using multi-layer PCB manufacturing process;Hu,2014

5. Molding compound and underfill material sets for a molded flip-chip SiP package;Zhang,2005

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4. A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging;Micromachines;2023-05-29

5. Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging;Materials Today Physics;2022-01

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