Temperature evolution of organosilicate glass films with organic bridges-Reference-Cited by-同舟云学术

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Temperature evolution of organosilicate glass films with organic bridges

Published:2024-01 Issue: Volume:363 Page:112783
ISSN:1387-1811
Container-title:Microporous and Mesoporous Materials
language:en
Short-container-title:Microporous and Mesoporous Materials

Author:

Vishnevskiy Alexey S.^ORCID,Seregin Dmitry S.,Palov Alexander P.,Orlov Georgy A.,Yakushev Vladislav A.,Ovchinnikov Ivan S.,Vorotilov Konstantin A.,Baklanov Mikhail R.

Funder

Ministry of Education and Science of the Russian Federation

Russian Science Foundation

Publisher

Elsevier BV

Subject

Mechanics of Materials,Condensed Matter Physics,General Materials Science,General Chemistry

Reference67 articles.

1. Dielectric Films for Advanced Microelectronics;Baklanov,2007

2. Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects;Pedreira,2017

3. Ruthenium metallization for advanced interconnects;Liang Gong,2016

4. Process for Damascene Structure with Reduced Low-K Damage;Naik,2015

5. Method for Producing an Integrated Circuit Including a Metallization Layer Comprising Low K Dielectric Material;Zhang,2017

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1. THE SUBTRACTIVE PROCESS OF FORMING A METALLIZATION SYSTEM.;Электронная техника. Серия 3. Микроэлектроника;2023

2. СУБТРАКТИВНЫЙ ПРОЦЕСС ФОРМИРОВАНИЯ СИСТЕМЫ МЕТАЛЛИЗАЦИИ;Электронная техника. Серия 3. Микроэлектроника;2023

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