Kinetics of sulfur and phosphorus surface segregation competition in copper
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference18 articles.
1. Grain Boundaries in Metals;McLean,1957
2. A model of the kinetics and equilibria of surface segregation in the monolayer regime
3. Theory of segregation kinetics in ternary systems
4. Determination of the diffusion coefficient of foreign atoms in metals via surface segregation
5. Activation energy of sulphur diffusion in ferromagnetic α-iron determined by surface segregation studies
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2. Typical Applications of AES and XPS;Springer Series in Surface Sciences;2012-06-01
3. Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints;Acta Materialia;2009-10
4. Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints;Acta Materialia;2008-11
5. Competitive segregation of impurities on the surface of polycrystalline copper;Bulletin of the Russian Academy of Sciences: Physics;2008-10
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