Formation of subsurface Cu-O-Si system through laser-induced plasma-assisted copper penetration for fabricating robust adhesive copper wire on glass substrate-Reference-Cited by-同舟云学术

Formation of subsurface Cu-O-Si system through laser-induced plasma-assisted copper penetration for fabricating robust adhesive copper wire on glass substrate

Published:2023-01 Issue: Volume:609 Page:155149
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Wei Kai,Lin Chih-Kuang^ORCID,Tung Pi-Cheng,Ho Jeng-Rong^ORCID,Tsao I-Yu^ORCID

Funder

Republic of China Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

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