Author:
Shi Junqin,Wang Junyi,Yi Xiaobin,Lu Yang,Hua Dongpeng,Zhou Qing,Fan Xiaoli
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference55 articles.
1. The use of monodispersed colloids in the polishing of copper and tantalum;Lu;J. Colloid Interface Sci.,2003
2. R. Christy, R. Stuart, K. Sujil, G. Prasanth, K. Sawant, K. Anitha, H. Rob, 8.3 A 3GHz ARM neoverse N1 CPU in 7nm FinFET for infrastructure applications, 2020 ISSCC, San Francisco, USA, (2020) 148-150.
3. Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process;Shi;Appl. Surf. Sci.,2018
4. The way to zeros: the future of semiconductor device and chemical mechanical polishing technologies;Tsujimura;Jpn. J. Appl. Phys.,2016
5. Scratching of patterned Cu/Dielectric surface layers by pad asperities in CMP;Kim;IEEE T Semiconduct. M.,2015
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献