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Microstructure and opto-electronic properties of Sn-rich Au-Sn diffusive solders

  • Published:2018-09 Issue: Volume:451 Page:32-39
  • ISSN:0169-4332
  • Container-title:Applied Surface Science
  • language:en
  • Short-container-title:Applied Surface Science

Author:

Rerek T.,Skowronski L.,Kobierski M.,Naparty M.K.,Derkowska-Zielinska B.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference24 articles.

1. Lead-free solder alloys: thermodynamic properties of the (Au + Sb + Sn) and (Au + Sb) system;Hindler;J. Chem. Thermodynam.,2012

2. Spontaneous growth of Sn whiskers and a new formation mechanism;Liu;Mater. Lett.,2016

3. Directive 2001/65/EU of the European Parliament and of the Council of 8 June 2011, Official Journal of the European Union L 174/88 (2011).

4. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng. R. Rep.,2002

5. Deformation behavior of (Cu, Ag)-Sn intermetallics by nanoindentation;Deng;Acta Mater.,2004

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