Environment-friendly electrochemical mechanical polishing using solid polymer electrolyte/CeO2 composite pad for highly efficient finishing of 4H-SiC (0001) surface-Reference-Cited by-同舟云学术

Environment-friendly electrochemical mechanical polishing using solid polymer electrolyte/CeO2 composite pad for highly efficient finishing of 4H-SiC (0001) surface

Published:2023-07 Issue: Volume:625 Page:157190
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Murata Junji^ORCID,Hayama Kenshin,Takizawa Masaru

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference51 articles.

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3. Influence of CMP damage induced during flattening SiC epitaxial layer on device performances;Masumoto;Mater. Sci. Semicond. Process.,2020

4. Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition;Doi;ECS J. Solid State Sci. Technol.,2016

5. Improved chemical mechanical polishing performance in 4H-SiC substrate by combining novel mixed abrasive slurry and photocatalytic effect;Wang;Appl. Surf. Sci.,2022

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