Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition-Reference-Cited by-同舟云学术

Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition

Published:2016 Issue:10 Volume:5 Page:P598-P607
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Doi Toshiro K.,Seshimo Kiyoshi,Yamazaki Tsutomu,Ohtsubo Masanori,Ichikawa Daizo,Miyashita Tadakazu,Takagi Masataka,Saeki Taku,Aida Hideo

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Doi T. K. , “Open innovation for a brighter future,” NATUREJOBS (2013), p.13.

2. Doi T. Yamazaki T. Seshimo K. Ichikawa D. , “Development of the polishing process technology of the crystal substrates for green devices (1st report)-Foundation of a Multi-Industry & University Join Research Project-, J23,” Proc. of JSPE spring meeting (2013), pp.631.

3. The Mechanism of Dilatancy

4. Colloidal Silica Polishing Based on Micro-Mechanical Removal Action and Its Application;Karaki-Doy;Sensors and Materials,1989

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