Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate-Reference-Cited by-同舟云学术

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Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate

Published:2015-11 Issue: Volume:355 Page:509-515
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Lim Ju Dy,Lee Pui Mun,Rhee Daniel Min Woo,Leong Kam Chew,Chen Zhong

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference20 articles.

1. Bonding of alumina and metal using bulk metallic glass forming alloy;Zhang;Int. J. Mod. Phys. B,2009

2. Adhesion improvement of RF-sputtered alumina coatings as determined by the scratch test;Ramos;J. Adhesion Sci. Technol.,1993

3. Corrosion study at Cu–Al interface in microelectronics packaging;Tan;Appl. Surf. Sci.,2002

4. New trends in power microelectronics DCB packages;Kužel;Microelectron. Int.,1992

5. Advantages and new development of direct bonded copper substrates;Schulz-Harder;Microelectron. Reliab.,2003

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