Corrosion study at Cu–Al interface in microelectronics packaging-Reference-Cited by-同舟云学术

Corrosion study at Cu–Al interface in microelectronics packaging

Published:2002-05 Issue:1-4 Volume:191 Page:67-73
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Tan C.W,Daud A.R,Yarmo M.A

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference15 articles.

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2. Gold diffusion and intermetallic formation in Au/Al2O3/Al film;Tsuge;J. Jpn. Inst. Met.,1995

3. Purple plague revisited;Philofsky;Solid-State Electron.,1970

4. G. Omar, T. Chee-wei, Development of copper wire bonding technology, in: Proceedings of the First ON Semiconductor Manufacturing Technology Symposium, 1999.

5. G.G. Harman, Reliability and Yield Problems of Wire Bonding in Microelectronics—The Application of Materials and Interface Science, International Society for Hybrid Microelectronics, USA, 1989.

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