Gold Diffusion and Intermetallic Formation in Au/Al2O3/Al Film

Author:

Tsuge Atsuko1,Mizuno Kaoru1,Uno Tomohiro1,Tatsumi Kohei1

Affiliation:

1. Advanced Technology Research Laboratories, Nippon Steel Corporation

Publisher

Japan Institute of Metals

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. The Effect of Aluminum Oxide Layer and Annealing Atmosphere on Diffusion Behavior of Ni/Al Film;Journal of the Japan Institute of Metals and Materials;2023-03-01

2. Au/Al Wire Bond Interface Resistance Degradation Rate Simulations;IEEE Transactions on Device and Materials Reliability;2019-12

3. Corrosion study at Cu–Al interface in microelectronics packaging;Applied Surface Science;2002-05

4. Implantation parameters affecting aluminum nano-particle formation in alumina;Journal of Materials Science;2001

5. Diffusion Behavior and Reliability in bonds between Au-Ag alloy and Aluminum;Journal of the Japan Institute of Metals;1999

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