Funder
Nano Material Technology Development Program
National Research Foundation of Korea
Ministry of Science, ICT and Future Planning
Innersensor co. ltd. and the Creative Economy Leading Technology Development Program
Gyeongsangbuk-Do and Gyeongbuk Science & Technology Promotion Center of Korea
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference32 articles.
1. Low temperature wafer-level metal thermo-compression bonding technology for 3D integration;Fan,2012
2. Wafer level Cu–Cu direct bonding for 3D integration;Kim;Microelectron. Eng.,2015
3. Wafer-level Cu–Cu bonding technology;Tang;Microelectron. Reliab.,2012
4. Cu passivation for enhanced low temperature (≤300°C) bonding in 3D integration;Lim;Microelectron. Eng.,2013
5. Advances in wafer level packaging (WLP);Tee;Microelectron. Reliab.,2010
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