Author:
Bogan J.,Brady-Boyd A.,Armini S.,Lundy R.,Selvaraju V.,O'Connor R.
Funder
Science Foundation Ireland Principle Investigator programme
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference35 articles.
1. M. Bohr, Interconnect scaling-the real limiter to high performance ULSI, in: Proceesings of the IEEE International Electronic Devices Meeting, 1995, pp. 241–244.
2. Z. Tokei, I. Ciofi, P. Roussel, P. Debacker, P. Raghavan, M.H. Van Der Veen, N.J ourdan, C.J. Wilson, V.V. Gonzalez, C. Adelmann, L. Wen, K.C roes, O.V.P.K. Moors, M. Krishtab, S. Armini, J. Bommels, On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control. Dig. Tech. Pap. - Symp. VLSI Technol., 2016, 2016–Septe.
3. F.W. Mont; X. Zhang; W. Wang; J.J. Kelly; T.E. Standaert, R. Quon, E. Todd, Cobalt interconnect on same copper barrier process integration at the 7 nm node, in: IITC 2017 - 2017 IEEE International Interconnect Technology Conference, 2017, pp. 7–9.
4. Superior thermal stability of Ta/TaN Bi-layer structure for copper metallization;Xie;Appl. Surf. Sci.,2006
5. Phase analysis of TaN/Ta barrier layers in sub-micrometer trench structures for Cu interconnects;Traving;Appl. Surf. Sci.,2005
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献