An XPS study of Al2Au and AlAu4 intermetallic oxidation-Reference-Cited by-同舟云学术

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An XPS study of Al2Au and AlAu4 intermetallic oxidation

Published:2007-05 Issue:14 Volume:253 Page:6217-6221
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Xu C.,Sritharan T.,Mhaisalkar S.G.,Srinivasan M.,Zhang S.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference20 articles.

1. The Study of Initial Mechanism for Al–Au Solid Phase Diffusion Flip-chip Bonding

2. Reliability of Au/Al bonding in plastic packages for high temperature (200°C) and high current applications

3. Thermal reliability of gold–aluminum bonds encapsulated in bi-phenyl epoxy resin

4. Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

5. Thin film aluminum–gold interface interactions

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