Thin film aluminum–gold interface interactions
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference15 articles.
1. The Study of Initial Mechanism for Al–Au Solid Phase Diffusion Flip-chip Bonding
2. Reliability of Au/Al bonding in plastic packages for high temperature (200°C) and high current applications
3. Thermal reliability of gold–aluminum bonds encapsulated in bi-phenyl epoxy resin
4. Y. Kizaki, M. Mori, M. Saito, in: Proc. IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 1995, pp. 105–108.
5. Diffusion in gold-aluminium
Cited by 25 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Kinetics of diffusion and phase formation in a solid-state reaction in Al/Au thin films;Journal of Alloys and Compounds;2024-10
2. Membrane-supported LSI with integrated heater and temperature monitor for on-site annealing-recovery from 20 kGy gamma ray irradiation damage;Sensors and Actuators A: Physical;2022-08
3. Corrosion behavior of monophasic and multiphasic Al50Au50 ribbons in AlCl3 + HCl solution;Corrosion Science;2020-04
4. Effect of the Structural Properties on the Electrical Resistivity of the Al/Ag Thin Films during the Solid-State Reaction;Physics of the Solid State;2020-04
5. 3D ToF‐SIMS view of interfacial diffusion between Cr 2 AlC coating and zircaloy substrate;Surface and Interface Analysis;2019-11-21
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3