Author:
Zhang Shanshan,Jin Weichao,Yang Huisheng,Gao Kewei,Pang Xiaolu,Yan Luchun,Volinsky Alex A.
Funder
Beijing Nova Program
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference30 articles.
1. Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability;Tsai;Microelectron. Reliab.,2015
2. Effect of copper- and silver-based films on alumina substrate electrical properties;Reboun;Ceram. Int.,2018
3. Advanced DBC (Direct Bonded Copper) substrates for high power and high voltage electronics;Schulz-Harder,2006
4. Advantages and new development of direct bonded copper substrates;Schulz-Harder;Microelectron. Reliab.,2003
5. Recent achievement in research for electronic packaging ceramic substrate materials;Hao;Ceramics,2007
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