Affiliation:
1. State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Harbin China
2. Chongqing Research Institute Harbin Institute of Technology Chongqing China
Abstract
AbstractThe bonding of thick Cu and AlN is necessary in power modules with the development of high‐frequency communication technology. In this work, 2 mm‐thick Cu was successfully bonded with AlN by using Sn9Zn solder with the assistance of ultrasonication at 230°C. Results showed that an AlN/Sn9Zn/Cu joint without crack was manufactured with a cooling rate of 7°C/min. Nonreactive wetting was realized between AlN and Sn9Zn, forming an amorphous transition layer. CuZn2 and CuZn were formed at the Sn9Zn/Cu interface. A joint with the highest bonding strength of 30.07 MPa was obtained, in which the AlN/Sn9Zn interface was no longer the weakest location. This work provides a low‐temperature manufacturing method for thick Cu/AlN joints.
Funder
China Postdoctoral Science Foundation
Postdoctoral Foundation of Hei Long Jiang Province
Subject
Materials Chemistry,Ceramics and Composites