Fabrication of selective electroless copper plating on PET sheet: Effect of PET surface structure on resolution and adhesion of copper coating-Reference-Cited by-同舟云学术

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Fabrication of selective electroless copper plating on PET sheet: Effect of PET surface structure on resolution and adhesion of copper coating

Published:2018-11 Issue: Volume:458 Page:734-742
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Huang Junjun,Tian Changan,Wang Jing,Liu Junfei,Li Yu,Liu Youhao,Chen Zhenming

Funder

Research Foundation of Hefei University

State Key Laboratory of Rare Earth Permanent Magnetic Materials

Natural Science Foundation of Anhui Province of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference33 articles.

1. Heat-resistant organic molecular layer as a joint interface for metal reduction on plastics surfaces;Sang;Appl. Surf. Sci.,2016

2. Electroless plating Cu-Co-P polyalloy on UV/ozonolysis irradiated polyethylene terephthalate film and its corrosion resistance;Hou;Appl. Surf. Sci.,2017

3. Electrochemically promoted electroless nickel-phosphorous plating on titanium substrate;Gao;Appl. Surf. Sci.,2017

4. Electroless plating of Ni-B film as a binder-free highly efficient electrocatalyst for hydrazine oxidation;Wen;Appl. Surf. Sci.,2017

5. Improved electroless plating method through ultrasonic spray atomization for depositing silver nanoparticles on multi-walled carbon nanotubes;Zhao;Appl. Surf. Sci.,2017

Cited by 35 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Altering the percolation threshold of PA66‐copper hybrid in an electroless copper deposition process by surface activation of the polymer;Polymer Composites;2024-07-02

2. Electroless Ni–P plating deposited simultaneously on both surface sides of a flexible indium tin oxide coated polyethylene terephthalate substrate;Journal of Materials Science: Materials in Electronics;2024-07

3. Enhancing air stability and conductivity of cotton fabrics through dual-metal electroless deposition;Journal of Materials Science;2024-06-16

4. Sustainable approach to electroless copper plating process;Transactions of the IMF;2024-04-04

5. Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture;REVIEWS ON ADVANCED MATERIALS SCIENCE;2024-01-01

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