Sustainable approach to electroless copper plating process-Reference-Cited by-同舟云学术

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Sustainable approach to electroless copper plating process

Published:2024-04-04 Issue:3 Volume:102 Page:129-135
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Jothilakshmi S.¹^ORCID,Rekha S.²^ORCID,Nagabalan U.³^ORCID,Kalpana B.⁴^ORCID

Affiliation:

1. Department of Chemistry, R.M.K. College of Engineering and Technology, Chennai, Tamil Nadu, India

2. Department of Chemistry, R.M.D. Engineering College, Chennai, Tamil Nadu, India

3. Department of Information Technology, R.M.D. Engineering College, Chennai, Tamil Nadu, India

4. Department of Electrical and Electronics Engineering, R.M.D. Engineering College, Chennai, Tamil Nadu, India

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/00202967.2024.2329456

Reference39 articles.

1. Investigation on the mechanical performance of the electroless Ni–W–P coating based on fractal theory

2. Synthesis and Morphological Characterization of Electroless-Deposited Ni-P Coatings on Diamond Abrasives

3. Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths: application of xylitol, D-mannitol and D-sorbitol as copper(II) ligands

4. A rigid, cyclohexane-based polyamino-polyalcohol as a versatile building block for tailored chelating agents

5. K. Burger and L. Nagy: In K. Burger (Ed), Bio coordination chemistry: coordination equilibria in biologically active systems, (Ellis Horwood, Chichester), 1990, 236. ISBN-13: 978-0131799127.

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