Altering the percolation threshold of PA66‐copper hybrid in an electroless copper deposition process by surface activation of the polymer

Abstract

AbstractIn this study, the impact of three different principles of surface activation techniques for polyamide fibers on the formation of conductive percolation during the subsequent electroless copper deposition process was investigated. The techniques used are (1) polyamide complexation using a solution mixture of calcium chloride, ethanol and water, (2) atmospheric plasma surface treatment and (3) grafting of 2‐hydroxyethylmethacrylate by radical induced polymerization. As a result, the percolation threshold was shifted to lower copper contents. The copper content required to form conductive structures was reduced ranged between 59% and 89%, depending on the activation techniques. Furthermore, the deposition time was reduced by 37%–57%, resulting in a faster build‐up of the percolation on the fabric. Changes in wetting behavior and substrate surface topography were identified to be the main reasons for these observations. While all applied surface activation techniques led to higher copper contents compared to unmodified reference, the atmospheric plasma modification led to the highest copper contents during the deposition process and a more uniform appearance of the metallised layer.Highlights Three different fiber surface activation methods are evaluated. Fiber surface activation increases wetting and polymer‐metal adhesion. Activated polymer surface leads to faster copper deposition and percolation. Atmospheric plasma modification is the most efficient technique.