Author:
Park C.E.,Han B.J.,Bair H.E.
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference9 articles.
1. The importance of material selection for flip chip on board assemblies
2. Chip on Board Technologies for Multichip Modules,1994
3. Proceedings of the 21st North American Thermal Analysis Society;Bair,1992
4. Investigations of Large PLCC Package Cracking During Surface Mount Exposure
5. Annual Technical Conference of the Society of Plastics Engineers;Park,1995
Cited by
32 articles.
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