Post-CMP Cleaning
Author:
Publisher
Elsevier
Reference103 articles.
1. Chemical Mechanical Planarization of Microelectronic Materials;Steigerwald,1997
2. Removal of Submicrometer Particles from Silicon Wafer Surfaces Using HF-Based Cleaning Mixtures
3. Cerium Oxide Slurries in CMP. Electrophoretic Mobility and Adsorption Investigations of Ceria/Silicate Interaction
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