Ultra-low load multiple indentation response of materials: In purview of wiresaw slicing and other free abrasive machining (FAM) processes-Reference-Cited by-同舟云学术

Ultra-low load multiple indentation response of materials: In purview of wiresaw slicing and other free abrasive machining (FAM) processes

Published:2007-03 Issue:3-4 Volume:47 Page:666-672
ISSN:0890-6955
Container-title:International Journal of Machine Tools and Manufacture
language:en
Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Bhagavat Sumeet,Kao Imin

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference18 articles.

1. Technology and research of slurry wiresaw manufacturing systems in wafer slicing with free abrasive machining;Kao;International Journal of Advanced Manufacturing Systems,2004

2. Basic mechanisms and models of multi-wire sawing;Moller;Advanced Engineering Materials,2004

3. Modeling stresses of contacts in wiresaw slicing of polycrystalline and crystalline ingots: application to silicon wafer production;Li;Journal of Electronic Packaging,1998

4. Nanoindentation of lithium niobate: hardness anisotropy and pop-in phenomenon;Bhagavat;Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing,2005

5. Finite element analysis of interacting vickers indentations on brittle materials;Zhang;Acta Materialia,2001

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