Development of microencapsulated phase change material slurry for diamond wire sawing silicon wafer and its effect on cutting quality-Reference-Cited by-同舟云学术

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Development of microencapsulated phase change material slurry for diamond wire sawing silicon wafer and its effect on cutting quality

Published:2024-10 Issue: Volume:127 Page:421-432
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Yao Chunyan,Yu Xiang,Feng Lei,Wang Fanyue,Wang Minghuan,Yuan Qiaoling

Funder

Zhejiang Province Natural Science Foundation

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference34 articles.

1. Achieving micron-scale plasticity and theoretical strength in silicon. Nature;Chen;Communications,2020

2. Manufacturing process of Nano integrated circuits;Rujing,2014

3. In diamond wire sawing of solar silicon wafers: A sustainable manufacturing alternative to loose abrasive slurry sawing, 15th global conference on sustainable manufacturing (GCSM), Technion Inst Technol, Haifa, ISRAEL, Sep 25–27;Kumar,2017

4. The research on the fabrication and the properties of diamond wire saw multi-crystalline black silicon;Wu,2017

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