Research on improving the discharge cutting efficiency of N-type high-resistance silicon based on electroless plating

Author:

Chen Zhibin,Qiu Mingbo,Zhao Jinchao,Qin Yan,Guo Chuangchaung,Wan Rong

Funder

national natural science foundation of china

national key laboratory of science and technology on helicopter transmission

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Reference27 articles.

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3. Rakwal D, Bamberg E (2009) Slicing, cleaning and kerf analysis of germanium wafers machined by wire electrical discharge machining. J Mater Process Technol 209:3740–3751

4. Li WT, Liu H, Chen HL (2004) Summary of the development of solar photovoltaic power generation at home and abroad. Qinghai Electr Power 23(04):3–6

5. Zhao JC, Qiu MB, Yan J, Lu P, Qin Y, Chen ZB (2020) Research on the machining characteristics of composite pulse power supply for the electrical discharge machining of semiconductor silicon crystal. Int J Adv Manuf Technol 111(7–8):1–13

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Electrical discharge machining of semiconductor materials: A review;Journal of Materials Research and Technology;2023-07

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