An inverse-distance weighting genetic algorithm for optimizing the wafer exposure pattern for enhancing OWE for smart manufacturing-Reference-Cited by-同舟云学术

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An inverse-distance weighting genetic algorithm for optimizing the wafer exposure pattern for enhancing OWE for smart manufacturing

Published:2020-09 Issue: Volume:94 Page:106430
ISSN:1568-4946
Container-title:Applied Soft Computing
language:en
Short-container-title:Applied Soft Computing

Author:

Wang Hung-Kai,Chien Chen-Fu^ORCID

Funder

Ministry of Science and Technology, Taiwan

Artificial Intelligence for Intelligent Manufacturing Systems (AIMS) Research Center, Taiwan

Taiwan Semiconductor Manufacturing Company

Artificial Intelligence for Intelligent Manufacturing Systems (AIMS) Research Center, Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Software

Reference28 articles.

1. Strategic capacity planning for smart production: Decision modeling under demand uncertainty;Chien;Appl. Soft Comput.,2018

2. Semiconductor fault detection and classification for yield enhancement and manufacturing intelligence;Chien;Flex. Serv. Manuf. J.,2013

3. Overall Wafer Effectiveness (OWE): A novel industry standard for semiconductor ecosystem as a whole;Chien;Comput. Ind. Eng.,2013

4. An iterative cutting procedure for determining the optimal wafer exposure pattern;Chien;IEEE Trans. Semicond. Manuf.,1999

5. A cutting algorithm for optimizing the wafer exposure pattern;Chien;IEEE Trans. Semicond. Manuf.,2001

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