Smart Cut™: Review on an attractive process for innovative substrate elaboration-Reference-Cited by-同舟云学术

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Smart Cut™: Review on an attractive process for innovative substrate elaboration

Published:2012-04 Issue: Volume:277 Page:84-92
ISSN:0168-583X
Container-title:Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms

Author:

Moriceau H.,Mazen F.,Braley C.,Rieutord F.,Tauzin A.,Deguet C.

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference45 articles.

1. Plasma Contamination and Wall Erosion in Thermonuclear Reactors

2. Role of integrated lateral stress in surface deformation of He‐implanted surfaces

3. La formation des cloques

4. Mechanical response of single crystal Si to very high fluence H+ implantation

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1. Ion Implantation;Integrated Circuit Fabrication;2023-11-16

2. Fabrication and characterization of silicon-on-insulator wafers;Micro and Nano Systems Letters;2023-11-13

3. Enhanced surface blistering efficiency of H+ implanted lithium tantalate by chemical reduction modification;Applied Surface Science;2023-06

4. Fabrication technology of void embedded silicon-on-insulator substrate;Acta Physica Sinica;2023

5. Brittle fracture studied by ultra-high-speed synchrotron X-ray diffraction imaging;Journal of Applied Crystallography;2022-07-30

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