Transformation of silica fume into chemical mechanical polishing (CMP) nano-slurries for advanced semiconductor manufacturing
Author:
Publisher
Elsevier BV
Subject
General Chemical Engineering
Reference16 articles.
1. Process characterization and statistical analysis of oxide CMP on a silicon wafer with sparse data
2. Chemical mechanical polishing of nickel for applications in MEMS devices
3. Finite-element analysis on wafer-level CMP contact stress: reinvestigated issues and the effects of selected process parameters
4. Chemical mechanical polishing (CMP) mechanisms of thermal SiO2 film after high-temperature pad conditioning
5. Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substrates
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1. Sustainable route for silica preparation from silica fume;Environmental Technology;2024-08-16
2. Atomic-scale surface of fused silica induced by chemical mechanical polishing with controlled size spherical ceria abrasives;Journal of Manufacturing Processes;2023-01
3. Development of novel multi-selective slurry with mechanically driven etching for through silicon via chemical mechanical polishing;Materials Science in Semiconductor Processing;2022-12
4. Preparation of the rod-shaped SiO2@C abrasive and effects of its microstructure on the polishing of zirconia ceramics;Powder Technology;2022-01
5. Estimating service life of reinforced concrete structures with binders containing silica fume and metakaolin under chloride environment: durability indicators and probabilistic assessment;Materials and Structures;2021-04
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