Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substrates-Reference-Cited by-同舟云学术

Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substrates

Published:2005-07 Issue:1 Volume:81 Page:117-124
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Zhong Z.W.,Wang Z.F.,Zirajutheen B.M.P.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference36 articles.

1. Reliability of FCOB with and without encapsulation;Zhong;Soldering and Surface Mount Technology,2001

2. Finite element analysis of a three dimensional package;Zhong;Soldering and Surface Mount Technology,2003

3. Interfacial behaviour of a flip chip structure under thermal testing;Zhong;IEEE Transactions on Electronics Packaging Manufacturing,2004

4. Grinding of single-crystal silicon along crystallographic directions;Zhong;Materials and Manufacturing Processes,2003

5. Investigation on the final polishing slurry and technique of silicon substrate in ULSI;Liu;Microelectronic Engineering,2003

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