Fatigue of polycrystalline silicon for microelectromechanical system applications: crack growth and stability under resonant loading conditions-Reference-Cited by-同舟云学术

Fatigue of polycrystalline silicon for microelectromechanical system applications: crack growth and stability under resonant loading conditions

Published:2004-01 Issue:1-2 Volume:36 Page:13-33
ISSN:0167-6636
Container-title:Mechanics of Materials
language:en
Short-container-title:Mechanics of Materials

Author:

Muhlstein C.L.,Howe R.T.,Ritchie R.O.

Publisher

Elsevier BV

Subject

Mechanics of Materials,General Materials Science,Instrumentation

Reference51 articles.

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3. ASTM, 2001a. E 466 standard practice for conducting force controlled constant amplitude axial fatigue tests of metallic materials. Annual Book of ASTM Standards, vol. 03.01. ASTM, West Conshohocken, PA

4. ASTM, 2001b. E 647 standard test method for measurement of fatigue crack growth rates. Annual Book of ASTM Standards, vol. 03.01. ASTM, West Conshohocken, PA

5. The fracture toughness of polysilicon microdevices: a first report;Ballarini;Adv. Appl. Mech.,1997

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