Author:
Ye Ko Ko Aung ,Simonov B. M.,Timoshenkov S. P.
Reference8 articles.
1. Aung, Y.K.K., Simonov, B.M., and Timoshenkov, S.P., Studying the functioning of the sensitive element of a capacitive accelerometer with a sandwich structure under the conditions of parasitic effects along the nonworking axes and random vibration, Russ. Microelectron., 2022, vol. 51, no. 7, pp. 611–618. https://doi.org/10.1134/S1063739722070150
2. Walraven, J.A., Failure mechanisms in MEMS, Int. Test Conf.
2003. Proc. ITC 2003, Charlotte, N.C., 2003, IEEE, 2003, pp. 828–833. https://doi.org/10.1109/TEST.2003.1270915
3. Muhlstein, C.L., Howe, R.T., and Ritchie, R.O., Fatigue of polycrystalline silicon for microelectromechanical system applications: Crack growth and stability under resonant loading conditions, Mech. Mater., 2004, vol. 36, nos. 1–2, pp. 13–33. https://doi.org/10.1016/S0167-6636(03)00028-0
4. MEMS Reliability Assurance Guidelines for Space Applications, Stark, B., Ed., Pasadena, Calif.: Jet Propulsion Lab., California Inst. of Technology, 1999.
5. Connally, J.A. and Brown, S.B., Slow crack growth in single-crystal silicon, Science, 1992, vol. 256, no. 5063, pp. 1537–1539. https://doi.org/10.1126/science.256.5063.1537