Reactive ion etching for high aspect ratio silicon micromachining

Author:

Rangelow I.W.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference18 articles.

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4. D.L. Flamm, Mechanisms of silicon etching in fluorine- and chlorine-containing plasmas, Rep. UCB/ERL M90/41, College of Engineering, University of California, Berkeley, 1989.

5. Simulation of RIE-processes considering sheath dynamics;Fichelscher;Mater. Sci. Eng.,1991

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