Advances in partial-pressure control applied to reactive sputtering-Reference-Cited by-同舟云学术

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Advances in partial-pressure control applied to reactive sputtering

Published:1989-12 Issue: Volume:39-40 Page:499-506
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Sproul W.D.,Rudnik P.J.,Gogol C.A.,Mueller R.A.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference15 articles.

1. High rate reactive sputtering process control

2. Modeling of reactive sputtering of compound materials

3. Partial pressure control of reactively sputtered titanium nitride

4. Effect of N2Ar mixing on the reactive sputtering characteristics of silicon

5. A physical model for eliminating instabilities in reactive sputtering

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1. Characteristics of continuous high power magnetron sputtering (C-HPMS) in reactive O2/Ar atmospheres;Journal of Applied Physics;2021-06-28

2. The Multipole Resonance Probe-based controller: a technology to investigate plasma-based deposition;Journal of Instrumentation;2019-10-08

3. An X-ray photoelectron spectroscopy study of the target surface composition after reactive magnetron sputtering;Surface and Coatings Technology;2018-11

4. Structure, composition and electronic transport properties of tungsten oxide thin film sputter-deposited by the reactive gas pulsing process;Materials Chemistry and Physics;2018-02

5. Physical Sputtering and Sputter Deposition;The Foundations of Vacuum Coating Technology;2018

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