Plasma enhanced chemical vapor deposition of SiN-films for passivation of three-dimensional substrates
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference10 articles.
1. Low temperature plasma deposition of silicon nitride to produce ultra-reliable, high performance, low cost sealed chip-on-board (SCOB) assemblies
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