Pressureless transient liquid phase bonding using SAC305 with hybrid Ag particles and its reliability under high-temperature storage test
Author:
Funder
Ministry of Education
Publisher
Elsevier BV
Subject
General Materials Science
Reference42 articles.
1. Materials, processing and reliability of low temperature bonding in 3D chip stacking;Zhang;J. Alloys Compd,2018
2. Ruythooren, study of the Au/IN reaction for transient liquid-phase bonding and 3D chip stack aging;Zhang;J. Electron. Mater.,2008
3. Die attach materials for high temperature applications: a review;Manikam;IEEE Trans. Compon. Packag. Manuf. Tech.,2011
4. Development of high-temperature solders: review;Zeng;Microelectron. Reliab.,2012
5. Transient liquid phase bonding for power semiconductor;Roh;J. Microelectron. Packag. Soc.,2017
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Mechanical properties and microstructures of Cu/In-48Sn alloy/Cu with low temperature TLP bonding;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
2. Transient liquid phase bonding of Cu@Sn core–shell particles with added Sn–3.0Cu–0.5Ag;Journal of Materials Science;2022-03
3. Recent Development of Joining and Conductive Materials for Electronic Components;MATERIALS TRANSACTIONS;2021-08-01
4. Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test;Journal of Electronic Materials;2021-07-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3