Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior-Reference-Cited by-同舟云学术

Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

Published:2019-12 Issue: Volume:8 Page:100503
ISSN:2589-1529
Container-title:Materialia
language:en
Short-container-title:Materialia

Author:

Du Chaowei,Soler Rafael,Völker Bernhard,Matoy Kurt,Zechner Johannes,Langer Gregor,Reisinger Michael,Todt Juraj,Kirchlechner Christoph^ORCID,Dehm Gerhard

Funder

Austrian Research Promotion Agency

Publisher

Elsevier BV

Subject

General Materials Science

Reference35 articles.

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3. Development of high-temperature solders: review;Zeng;Microelectron. Reliab.,2012

4. Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for mems wafer-level packaging;Marauska;Microsyst. Technol.,2013

5. Experimental study of the kinetics of transient liquid phase solidification reaction in electroplated gold-tin layers on copper;Venkatraman;Metal. Mater. Trans. A,1997

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