UV irradiation effects on the bonding structure and electrical properties of ultra low-k SiOC(–H) thin films for 45 nm technology node-Reference-Cited by-同舟云学术

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UV irradiation effects on the bonding structure and electrical properties of ultra low-k SiOC(–H) thin films for 45 nm technology node

Published:2011-09 Issue:5 Volume:11 Page:S109-S113
ISSN:1567-1739
Container-title:Current Applied Physics
language:en
Short-container-title:Current Applied Physics

Author:

Choi Chi Kyu,Kim Chang Young,Navamathavan R.,Lee Heang Seuk,Woo Jong-Kwan,Hyun Myung Taek,Lee Heon Ju,Jeung Won Young

Publisher

Elsevier BV

Subject

General Physics and Astronomy,General Materials Science

Reference15 articles.

1. Porous pSiCOH Ultralow-k Dielectrics for Chip Interconnects Prepared by PECVD

2. Low dielectric constant materials for microelectronics

3. A study on the formation and characteristics of the SiOCH composite thin films with low dielectric constant for advanced semiconductor devices

4. Surface Modification of H-Ferrierite by Reaction with Triethoxysilane

5. Plasma Diagnostics during Plasma-Enhanced Chemical-Vapor Deposition of Low-Dielectric-Constant SiOC(-H) Films from TES/O2 Precursors

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1. Comprehensive Review on the Impact of Chemical Composition, Plasma Treatment, and Vacuum Ultraviolet (VUV) Irradiation on the Electrical Properties of Organosilicate Films;Polymers;2024-08-05

2. Substrate-Dependent Area-Selective Atomic Layer Deposition of Noble Metals from Metal β-Diketonate Precursors;Chemistry of Materials;2022-09-05

3. Impact of VUV photons on SiO2 and organosilicate low-k dielectrics: General behavior, practical applications, and atomic models;Applied Physics Reviews;2019-03

4. Chemical Treatment of Low-k Dielectric Surfaces for Patterning of Thin Solid Films in Microelectronic Applications;ACS Applied Materials & Interfaces;2016-03-01

5. Effect of UV curing time on physical and electrical properties and reliability of low dielectric constant materials;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2014-11

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