Author:
Long Xu,Xu Junmeng,Wang Shaobin,Tang Wenbin,Chang Chao
Funder
National Natural Science Foundation of China
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Civil and Structural Engineering
Reference27 articles.
1. 2007 Ninth Electronics Packaging Technology Conference;Selvanayagam,2007
2. Stress–strain characteristics of tin-based solder alloys for drop-impact modeling;Wong;J Electron Mater,2008
3. Advances in the drop-impact reliability of solder joints for mobile applications;Wong;Microelectron Reliab,2009
4. Mechanical properties of SNPB and lead-free solders at high rates of strain;Siviour;J Phys D Appl Phys,2005
5. 2008 Eleventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems;Luhua,2008
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