Analysis of long term reliability of plated-through holes in multilayer interconnection boards Part B: Fatigue results and fracture mechanisms-Reference-Cited by-同舟云学术

Analysis of long term reliability of plated-through holes in multilayer interconnection boards Part B: Fatigue results and fracture mechanisms

Published:1986-01 Issue:4 Volume:26 Page:733-751
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Vecchio K.S.,Hertzberg R.W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Vecchio, K. S. and Hertzberg, R. W., “Analysis of Long Term Reliability of Plated-Through-Holes in Multilayer Interconnection Boards.” Part A: Stress Analyses and Material Characterization,” to be published.

2. A New Set of Printed-Circuit Technologies for the IBM 3081 Processor Unit;Seraphim;IBM Journal of Research and Development,1982

3. Methods for Evaluating Plated-Through Hole Reliability;Oien,1976

4. The Detection of Barrel Cracks in Plated Through Holes Using Four Point Resistance Measurements;Rudy,1976

5. Measurement of Thermo-Mechanical Strains in Plated-Through-Holes;Ammann,1976

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