Particle Removal by Surfactants During Semiconductor Cleaning

Author:

Yerriboina Nagendra Prasad,Poddar Maneesh Kumar,Park Jin-Goo

Publisher

Elsevier

Reference74 articles.

1. Personal communication from IB Kim, IBS Inc., Los Gatos, CA (July 2021).

2. Overview and Evolution of Silicon Wafer Cleaning Technology;Kern,2018

3. Integration Challenges for CMP of Copper;Bajaj;MRS Bull.,2002

4. Particle Removal and its Mechanism on Hydrophobic Silicon Wafer in Highly Diluted NH4OH Solutions with an Added Surfactant;Park;Jpn. J. Appl. Phys.,2001

5. Mechanism of a New Post CMP Cleaning for Trench Isolation Process;Miyashita,1999

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