Lead-Free Solder
Author:
Publisher
Elsevier
Reference40 articles.
1. Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications;Anderson;Journal of Materials Science Materials in Electronics,2007
2. The role of elastic and plastic anisotropy of Sn on recrystallization and damage evolution during thermal cycling in SAC305 solder joints;Bieler;Journal of Electronic Materials,2012
3. Pb-free solder: New materials considerations for microelectronics processing;Borgesen;MRS Bulletin,2007
4. Significance of nucleation kinetics in Sn whisker formation;Chason;Journal of Electronic Materials,2014
5. Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys;Chawla;Journal of Materials Science-Materials In Electronics,2007
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Micro‐Particle Induced X‐ray Emission Study of Lead‐Free and Lead‐Based Solders and Interactions with Copper Wires;physica status solidi (a);2023-01-04
2. FIB-SEM based 3D tomography of micro-electronic components: Application to automotive high-definition LED lighting systems;Microelectronics Reliability;2022-10
3. The Recovery of Metallic Tin from an Industrial Tin-Bearing By-Product Containing Na2SO4 by Reduction Smelting Process;Metals;2021-10-25
4. Solder joint reliability based on creep strain energy density for SAC305 and doped SAC solders;MATEC Web of Conferences;2021
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