FIB-SEM based 3D tomography of micro-electronic components: Application to automotive high-definition LED lighting systems

Author:

Noçairi Safa,Compère Nicolas,Bermond Antonin,Roucoules Christine,Sao-Joao Sergio,Lenci Matthieu,Kermouche Guillaume,Klöcker Helmut

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference33 articles.

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4. Microstructural investigation of lead-free BGAs soldered with tin-lead solder;Grossmann;Soldering Surf. MountTechnol.,2005

5. Zhang Q., Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces, ISBN 978-3-662-48821-8, DOI https://doi.org/10.1007/978-3-662-48823-2 (Doctoral Thesis accepted by University of Chinese Academy of Sciences, Beijing, China, ISSN 2190-5053, Springer Theses).

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