A Conceptual Framework for “Industry 3.5” to Empower Intelligent Manufacturing and Case Studies-Reference-Cited by-同舟云学术

A Conceptual Framework for “Industry 3.5” to Empower Intelligent Manufacturing and Case Studies

Published:2017 Issue: Volume:11 Page:2009-2017
ISSN:2351-9789
Container-title:Procedia Manufacturing
language:en
Short-container-title:Procedia Manufacturing

Author:

Chien Chen-Fu,Hong Tzu-yen,Guo Hong-Zhi

Publisher

Elsevier BV

Subject

Artificial Intelligence,Industrial and Manufacturing Engineering

Reference9 articles.

1. C.-F. Chien, K.-Y. Lin, J.-B. Sheu, C.-H. Wu. Retrospect and Prospect on Operations and Management Journals in Taiwan: From Industry 3.0 to Industry 3.5. J Management 33 (1)(2016) 87-103.

2. C.-F. Chien, Y.J. Chen, and J. T. Peng. Manufacturing intelligence for semiconductor demand forecast based on technology diffusion and product life cycle. IJPE 128 (2)(2010) 496-509.

3. C.-F. Chien, S.C. Chuang. A framework for root cause detection of sub-batch processing system for semiconductor manufacturing big data analytics, IEEE Trans. Semiconductor Manufacturing 27 (4)(2014) 475-488.

4. C.-F. Chien, Y.J. Chen, C.Y. Hsu, H.K. Wang. Overlay error compensation using advanced process control with dynamically adjusted proportional-integral R2R controller. IEEE Trans. Automation Science and Engineering 11 (2)(2014) 473-484.

5. C.-F. Chien, Y.J. Chen, and C. Y. Hsu. A novel approach to hedge and compensate the critical dimension variation of the developed-andetched circuit patterns for yield enhancement in semiconductor manufacturing. Computers & Operations Research 53(2015) 309-318.

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