The Effects of Humidity on Tin Whisker Growth by Immersion Tin Plating and Tin Solder Dipping Surface Finishes-Reference-Cited by-同舟云学术

The Effects of Humidity on Tin Whisker Growth by Immersion Tin Plating and Tin Solder Dipping Surface Finishes

Published:2015 Issue: Volume:2 Page:275-279
ISSN:2351-9789
Container-title:Procedia Manufacturing
language:en
Short-container-title:Procedia Manufacturing

Author:

Lim Hooi Peng,Ourdjini Ali,Bakar Tuty Asma Abu,Tesfamichael Tuquabo

Publisher

Elsevier BV

Subject

Artificial Intelligence,Industrial and Manufacturing Engineering

Reference8 articles.

1. C. B. Lee, Y.L. Yao, F.Y. Chiang, P.J. Zheng, C.C. Liao and Y. S. Chou, Characterization Study of Lead-free SnCu Plated Packages, 2006.

2. P. Oberndoff, M. Dittes, P. Crema, P. Su and E. Yu, Humidity Effects on Sn Whisker Formation, IEEE Trans. Electron. Pack. Manufac., vol. 29, no. 4, pp. 242-243, 2006.

3. M. Dittes, P. Oberndoff and L. Petit, Tin Whisker Formation-Results, Test Methods and Countermeasures, in Prog. 53rd Electron. Com. Tech. Con., May 2003.

4. J. S. JESD22-A121A, Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes, JEDEC Solid State Technology Association, Arlington VA, July 2008.

5. NEMI, Tin Whisker Acceptance Test Requirements, NEMI Tin Whisker Users Group, July 2004.

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