Author:
Moore Thomas D.,Jarvis John L.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Application of the Taguchi method on the robust design of molded 225 plastic ball grid array packages;Mertol;IEEE Trans Comp Pkgg Manuf Tech Part B – Adv Pkgg,1995
2. Optimization of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages for robust design;Mertol;IEEE Trans Comp Pkgg Manuf Tech Part B – Adv Pkgg,1997
3. Mercado LL, Sarihan V. Predictive design of flip-chip PBGA for high reliability and low cost. 1999 Proc 49th Electronic Components and Technology Conference, ECTC 99, San Diego, CA, 1999. p. 1111–5
4. McCluskey P, Munamarty R, Pecht M. Popcorning in PBGA packages during IR reflow soldering. Proc. International Electronics Packaging Conference Int Electron Pkgg Soc, Edina, MN, 1996. p. 271–81
5. Egan E, Kelly G, Herard L. PBGA warpage and stress prediction for efficient creation of the thermomechanical design space for package-level reliability. Proc. 49th Electronic Components and Technology Conference, ECTC 99, San Diego, CA, 1999. p. 1217–23
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